RFP QuestBeta
ClosedStage · contract

COMPOUND SEMICONDUCTOR APPLICATIONS CATAPULT LIMITED

Ceramic 3D Printer

Laboratory EquipmentCPV 38000000
Value£588k
Deadline17 May 2021
Published21 Apr 2022
RegionWales
Timeline
Published 21 Apr 2022ClosedCloses 17 May 2021
Contract value in context
£588ktotal contract value
median £70k
this tender£0£635k

This is a large award for Laboratory & Precision Equipment — above three-quarters of comparable contracts. Based on 9,869 valued Laboratory & Precision Equipment tenders in our corpus.

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The brief

Scope The Compound Semiconductor Applications Catapult is looking to create a modular, flexible, accelerated prototype package assembly and test facility to support developments around vehicle electrification incorporating compound semiconductor devices, modules and systems.

This would allow experimentation, feasibility, proof of concept and small prototype volume build.

As part of the package assembly research and development methodology, we require a ceramic 3D printer and post processing ovens to fabricate ceramic materials, capable of producing items suited to high temperature use.

The printer shall allow CSA Catapult to create ceramic prototypes of arbitrary size and shape, ranging from 1 - 100 mm in length, particularly 40 x 70 x 100 as a minimum acceptable build volume.

We are also interested in multi material capability allowing a minimum of two materials to be printed and form a solid (green / uncured) model.

The parts created will be used functionally, so repeatability, dimensional consistency and process reliability are paramount.

The estimated value of the contract is £500,000 to £650,000 including all options and extensions.

The system will be installed at the CSA Catapult Innovation Centre in 2021.

Key requirements

What the supplier must deliver

01

The Compound Semiconductor Applications Catapult is looking

The Compound Semiconductor Applications Catapult is looking to create a modular, flexible, accelerated prototype package assembly and test facility to support developments around vehicle electrification incorporating compound semiconductor devices, modules and systems.

02

As part of the package assembly research

As part of the package assembly research and development methodology, we require a ceramic 3D printer and post processing ovens to fabricate ceramic materials, capable of producing items suited to high temperature use.

03

The printer shall allow CSA Catapult

The printer shall allow CSA Catapult to create ceramic prototypes of arbitrary size and shape, ranging from 1.

Derived from the notice text — always confirm against the original documents.

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Source & provenance
OCID
42156426-6041-4635-adef-d2ad6c1da5dc
Stage
contract · Contract
Source
Contracts Finder
Buyer ref
ICT-2021-045
View the original notice on Contracts Finder

Contains public sector information licensed under the Open Government Licence v3.0. Source data © Crown copyright.

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