Thermal Imaging IR Camera System

The Compound Semiconductor Applications (CSA) Catapult is creating a modular, flexible, accelerated prototype package assembly and test facility for RF, Photonics, and Power compound semiconductor devices, modules and systems.

The facility enables research, proof of concept and provides capability to demonstrate feasibility and undertake small volume prototype builds.

As a part of the package assembly research and development methodology, we require an IR thermal imaging system to validate compound semiconductor-based package/module/PCB thermal designs and potentially to test materials.

This equipment shall be capable of capturing transient temperature profile of power devices and modules, ideally in the 10s of kHz regime (with window/sub window options), with high spatial optical resolution, ideally down to 5-10 m range, and high thermal sensitivity, with ~ ±2% or 2 oC precision (whichever is higher precision), covering up to 300 oC.

The system shall also allow flexibility to measure high optical resolution images as well as large field of views, for example in the 10s of mm range as well as 10s of cm range, with its optics options, including lens mounting accessories (tubes, mounts, interchangeable rigs and so forth), with an acquisition time less than 1s.

The mounting optics and camera aperture shall match such that vignetting be avoided.

This system will be used mostly for Power Electronics packages, and will be useful for RF and photonics packages, as well.

Flexibility of the system for various lens mounting and frequency modulation options (for the detector) will be required.

The camera focus shall be easy.

If the detector is cooled by active means, a vibration isolator should be needed, depending on the distortion in the thermal image, to minimize vibration due to the cooling unit.

An additional sample translation stage (x-y) with a position sensitivity lower than the best achievable optical resolution of the system shall be required for accurate thermal images and possible future upgrades of the system.

Maximum weight the stage can withstand shall be adequate for thermal imaging of electronic systems.

The system shall provide a thermal image analysis software and provide options for software development kits (SDK), for example compatible with LabVIEW, MATLAB and so forth, for extended application ranges.

The manufacturer/authorised vendor shall install the system at the Innovation Centre, CSA Catapult, within the Advanced Packaging Laboratory, which will be equipped with access to all power and services for full installation and operation and be used to support contract research and development or commercial opportunities within the UK.

The manufacturer/authorised vendor is also responsible for providing necessary training, warranty and service/maintenance support.

The manufacturer/authorised vendor shall install the system at the Innovation Centre, CSA Catapult, by March 2021.