Compound Semiconductor Applications Catapult
Die Bonder
This sits in the upper-middle of the Laboratory & Precision Equipment band — a substantial contract for the sector. Based on 9,869 valued Laboratory & Precision Equipment tenders in our corpus.
The Compound Semiconductor Applications Catapult is looking to create a modular, flexible, accelerated prototype package assembly and test facility for RF, Photonics, and Power compound semiconductor devices, modules and systems.
This would allow experimentation, feasibility, proof of concept and small prototype volume build.
As part of the package assembly research and development methodology we require a machine to perform die bonding on to package, module and PCB boards.
The bonding equipment shall allow manual and semi-automatic bonding for experimentation and low volume prototype build.
It shall be adaptable to bond a wide variety of components from chip level through to module level using organic-inorganics substrates, a variety of adhesives, and PCBs for all required package architectures required for Photonics, Power, and RF, e.g. standard industry package units; multi-chip modules and System-in-Package solutions.
The system will be in the CSA Catapults Innovation Centre, within the Advanced Packaging Laboratory, which will be equipped with access to all power and services for full installation and operation.
The Catapult may also purchase additional, related services.
What the supplier must deliver
The bonding equipment shall allow manual
The bonding equipment shall allow manual and semi-automatic bonding for experimentation and low volume prototype build.
Derived from the notice text — always confirm against the original documents.
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- OCID
- e9a381d2-39b0-40a2-a6cd-4eb7e6a5d966
- Stage
- contract · Contract
- Source
- Contracts Finder
- Buyer ref
- ICT-2019-027
Contains public sector information licensed under the Open Government Licence v3.0. Source data © Crown copyright.
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