RFP QuestBeta
ClosedStage · tender

COMPOUND SEMICONDUCTOR APPLICATIONS CATAPULT LIMITED

Ceramic 3D Printer

Laboratory EquipmentCPV 38000000
Value£650k
Deadline17 May 2021
Published16 Apr 2021
RegionNationwide
Timeline
Published 16 Apr 2021ClosedCloses 17 May 2021
Who to contact
=
procurement@csa.catapult.org.uk

The procurement contact named on the official notice.

How to submit
Open the submissions portal

The submission route named on the official notice.

Contract value in context
£650ktotal contract value
median £70k
this tender£0£702k

This is a large award for Laboratory & Precision Equipment — above three-quarters of comparable contracts. Based on 9,869 valued Laboratory & Precision Equipment tenders in our corpus.

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The brief

Scope The Compound Semiconductor Applications Catapult is looking to create a modular, flexible, accelerated prototype package assembly and test facility to support developments around vehicle electrification incorporating compound semiconductor devices, modules and systems.

This would allow experimentation, feasibility, proof of concept and small prototype volume build.

As part of the package assembly research and development methodology, we require a ceramic 3D printer and post processing ovens to fabricate ceramic materials, capable of producing items suited to high temperature use.

The printer shall allow CSA Catapult to create ceramic prototypes of arbitrary size and shape, ranging from 1 - 100 mm in length, particularly 40 x 70 x 100 as a minimum acceptable build volume.

We are also interested in multi material capability allowing a minimum of two materials to be printed and form a solid (green / uncured) model.

The parts created will be used functionally, so repeatability, dimensional consistency and process reliability are paramount.

The estimated value of the contract is £500,000 to £650,000 including all options and extensions.

The system will be installed at the CSA Catapult Innovation Centre in 2021.

Key requirements

What the supplier must deliver

01

The Compound Semiconductor Applications Catapult is looking

The Compound Semiconductor Applications Catapult is looking to create a modular, flexible, accelerated prototype package assembly and test facility to support developments around vehicle electrification incorporating compound semiconductor devices, modules and systems.

02

As part of the package assembly research

As part of the package assembly research and development methodology, we require a ceramic 3D printer and post processing ovens to fabricate ceramic materials, capable of producing items suited to high temperature use.

03

The printer shall allow CSA Catapult

The printer shall allow CSA Catapult to create ceramic prototypes of arbitrary size and shape, ranging from 1.

Derived from the notice text — always confirm against the original documents.

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Source & provenance
OCID
ocds-h6vhtk-02a6ea
Stage
tender · Open
Source
Find a Tender
Buyer ref
008057-2021
View the original notice on Find a Tender

Contains public sector information licensed under the Open Government Licence v3.0. Source data © Crown copyright.

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