RFP QuestBeta
Awarded · ResultStage · award

University of Strathclyde

Supply, Delivery and Installation of wafer dicing kit for NMIS

Electrical EquipmentCPV 31712330
ValueValue not published
Awarded
Published16 Jan 2025
RegionNationwide
Outcome — awarded
S3 Alliance Ltd

This is a contract result notice, not an open opportunity. Details from the official award data.

Who to contact
jen.robertson@strath.ac.uk
+44 7811592949

The procurement contact named on the official notice.

The brief

The National Manufacturing Institute Scotland is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors.

To support this expansion, NMIS intends to procure equipment that can support a wide variety of power electronic semiconductor designs and packaging requirements.

The concept design for the facility will support a publicly funded project which will see the creation of an advanced facility for developing and scaling-up packaging capabilities and includes provision of equipment that is sufficiently flexible to support a wide variety of power electronic semiconductor design and packaging requirements.

Key requirements

What the supplier must deliver

01

To support this expansion, NMIS intends

To support this expansion, NMIS intends to procure equipment that can support a wide variety of power electronic semiconductor designs and packaging requirements.

Derived from the notice text — always confirm against the original documents.

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Source & provenance
OCID
ocds-h6vhtk-047100
Stage
award · Awarded
Source
Find a Tender
Buyer ref
001435-2025
View the original notice on Find a Tender

Contains public sector information licensed under the Open Government Licence v3.0. Source data © Crown copyright.

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