Silicon Wafers for Test Chips
This is a contract result notice, not an open opportunity. Details from the official award data.
The procurement contact named on the official notice.
As part of the existing Technology Development Element (TDE) contract with the European Space Agency (ESA), the Open University (OU), in company with Teledyne-e2v, are required to procure and test three experimental test chips for characterisation and testing.
Phase 1: To procure Silicon wafers for the manufacture of Front Side Illuminated (FSI) soft X-ray Complementary Metal Oxide Semiconductor (CMOS) imaging detectors to characterise their Electro Optical (EO) performance both pre and post irradiation.
Phase 2: A potential second phase subject to funding to process any remaining Silicon wafers from the first phase for the manufacture of Back Side Illuminated (BSI) soft X-ray CMOS imaging detectors to characterise their EO performance both pre and post irradiation.
Phase 3: A potential third phase subject to funding to procure Silicon wafers to manufacture another batch of either FSI or BSI soft X-ray CMOS imaging detectors for further characterisation of their EO performance both pre and post irradiation.
Cost Phase 1: £220,000 Phase 2: £250,000 Phase 3: £350,00 Total: £820,000
What the notice asks for
As part of the existing Technology Development
As part of the existing Technology Development Element (TDE) contract with the European Space Agency (ESA), the Open University (OU), in company with Teledyne-e2v, are required to procure and test three experimental test chips for characterisation and testing.
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- OCID
- ocds-h6vhtk-055960
- Stage
- award · Awarded
- Source
- Find a Tender
- Buyer ref
- 049225-2025
Contains public sector information licensed under the Open Government Licence v3.0. Source data © Crown copyright.
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