Sub-Micron Die Bonder
The procurement contact named on the official notice.
We are seeking equipment that can provide a wide range of bonding technologies to cater for semiconductor die to wafer, die to chip, wafer to wafer, fli-chip and other semiconductor chiplet bonding, to support our work in Heterogeneous Integration for Microelectronics and Semiconductor Systems.
What the supplier must deliver
We are seeking equipment that can provide
We are seeking equipment that can provide a wide range of bonding technologies to cater for semiconductor die to wafer, die to chip, wafer to wafer, fli-chip and other semiconductor chiplet bonding, to support our work in Heterogeneous Integration for Microelectronics and Semiconductor Systems.
Derived from the notice text — always confirm against the original documents.
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- OCID
- ocds-h6vhtk-05f213
- Stage
- planning · Planning
- Source
- Find a Tender
- Buyer ref
- 081169-2025
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