UKRI-3154 Indium deposition system

This is a contract result notice, not an open opportunity. Details from the official award data.

The procurement contact named on the official notice.

STFC Interconnect provides a range of electronic and detector assembly techniques to scientific communities within STFC and our external collaborations.

We have developed a process to perform surface preparation and make micro bumps of pure Indium metal, on a range of substrates including semiconductor wafers and semiconductor die.The resulting bumps are then used in our proprietary flip chip process to make many thousands or tens-of-thousands of electrical/mechanical connections in a single bonding step.The deposition process involves masking prior to deposition, then deposition, followed by removal of masked areas, leaving the desired bumps in place.

Photo lithography (negative resist, lift-off) and shadow masking techniques are both used.

We are now scaling this process into production and need new equipment capable of depositing on multiple substrates per day.

Free to start. Named contacts come from published notices; the strategy is generated from the buyer’s news, accounts and people.