This is a contract result notice, not an open opportunity. Details from the official award data.

The procurement contact named on the official notice.

STFC Interconnect provides a range of electronic and detector assembly techniques to scientific communities within STFC and our external collaborations.

We have developed a process to perform surface preparation and make micro bumps of pure Indium metal, on a range of substrates including semiconductor wafers and semiconductor die.The resulting bumps are then used in our proprietary flip chip process to make many thousands or tens-of-thousands of electrical/mechanical connections in a single bonding step.The deposition process involves masking prior to deposition, then deposition, followed by removal of masked areas, leaving the desired bumps in place.

Photo lithography (negative resist, lift-off) and shadow masking techniques are both used.

We are now scaling this process into production and need new equipment capable of depositing on multiple substrates per day.