UKRI-3441 Ball Bonder for Studding and Wire Bonding of Microelectronic Components
This is a contract result notice, not an open opportunity. Details from the official award data.
UK Research and Innovation's (UKRI) Science and Technology Facilities Council (STFC) had a requirement for the provision of a Ball Bonder for Studding and Wire Bonding of Microelectronic.
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- OCID
- ocds-h6vhtk-043a8b
- Stage
- award · Awarded
- Source
- Find a Tender
- Buyer ref
- 005140-2024
Contains public sector information licensed under the Open Government Licence v3.0. Source data © Crown copyright.
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