NMIS Power Electronics Advanced Packaging Semiconductor Facility, dedicated die bonding, wire bonding, and encapsulation equipment.
This is a contract result notice, not an open opportunity. Details from the official award data.
NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors.
To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements.
The initial focus will be procuring equipment to support die bonding, wire bonding and encapsulation and associated ancillaries required.
What the supplier must deliver
To support this expansion, NMIS intends
To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements.
The initial focus will be procuring equipment
The initial focus will be procuring equipment to support die bonding, wire bonding and encapsulation and associated ancillaries required.
Derived from the notice text — always confirm against the original documents.
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- OCID
- ocds-h6vhtk-03f66f
- Stage
- award · Awarded
- Source
- Find a Tender
- Buyer ref
- 020273-2024
Contains public sector information licensed under the Open Government Licence v3.0. Source data © Crown copyright.
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