Supply, Delivery and Installation of Hermetic Sealing Kit
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The submission route named on the official notice.
Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure.
Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption.
The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products.
NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology – reducing time-to-market and anchoring value onshore.
Description The University of Strathclyde has a requirement for an advanced Hermetic Sealing capability consisting of Seam Sealing and Projection Welding of hermetic packages used in photonic and advanced semiconductor packaging.
What the supplier must deliver
NCASP is creating an integrated, industry-led scale-up
NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology.
Derived from the notice text — always confirm against the original documents.
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Typical UK bid effort for the value not published — mid-band assumed band — an estimate, not a quote.
Qualify & bid/no-bid ~10% · SQ / PQQ ~20% · Written response ~55% · Review & presentation ~15%
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- Hold at bidFinancial standing (accounts, often ~2× contract value turnover)
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- OCID
- ocds-h6vhtk-06d818
- Stage
- tender · Open
- Source
- Find a Tender
- Buyer ref
- 072390-2026
Contains public sector information licensed under the Open Government Licence v3.0. Source data © Crown copyright.
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