Supply of Semiconductor Dicing and Grinding Systems
This is a contract result notice, not an open opportunity. Details from the official award data.
The procurement contact named on the official notice.
This Tender Specification is for the supply and installation of a Wafer Dicing System and a Wafer Grinding System.
These systems will be of strategic importance in expanding the capabilities that the CISM will be able to provide, and reliability of the equipment is paramount to maintaining and supporting the wide array of experimental work that will be conducted within the facility.
This requirement is split into two separate lots
What the supplier must deliver
This Tender Specification is for the supply
This Tender Specification is for the supply and installation of a Wafer Dicing System and a Wafer Grinding System.
These systems will be of strategic importance
These systems will be of strategic importance in expanding the capabilities that the CISM will be able to provide, and reliability of the equipment is paramount to maintaining and supporting the wide array of experimental work that will be conducted within the facility.
Derived from the notice text — always confirm against the original documents.
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- OCID
- ocds-h6vhtk-02cb8f
- Stage
- award · Awarded
- Source
- Find a Tender
- Buyer ref
- 027974-2021
Contains public sector information licensed under the Open Government Licence v3.0. Source data © Crown copyright.
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