Contracts Finder · Historical
Die Bonding System
Historical: no longer open for bids.
01/ The notice
Key facts
- Value
- Not statedValue not stated in source
- Deadline (UK time)
- Thu 16 Jul 2026, 12:00 BSTA deadline does not apply to this historical notice. The source records Thu 16 Jul 2026, 12:00 BST, which is not an open deadline.
- Published
- 1 Jul 2026
- Region
- Any region
02/ The brief
What the notice says
Not fully read: this is the notice text; attached documents are not read.
Funding is available to purchase a die attach/bonding system capable of performing a wide range of bonding processes, including ultrasonic, flip-chip, and UV curing, which is suitable for prototyping and light production runs. As a result, a crucial aspect for any die attach system under is the ability to be used for bonding runs as small as a single die should this be required. This stipulation lends itself to a semi-automated (i.e. motorised) system, ideally with the capacity to store process recipes to maximise reproducibility should the system be used for light production runs.
03/ Classification
CPV codes
Common Procurement Vocabulary codes, exactly as the notice lists them. No descriptions are added here.
- 38000000
04/ History
Releases of this notice
One release held, oldest first. Dates are UK time.
- 1 Jul 2026Contract notice
Contract notice published 1 July 2026.
Release 21933349-7465-49c1-a0c0-59f1caeb33ed
View this release on Contracts Finder (opens in a new tab)
05/ Limits
What the source does not tell us
- The source does not state a usable value.
- Only one release is held, so there is no change history.
06/ Questions
About this notice
07/ Related
Where to go next
These links follow a fixed rule applied to this notice’s buyer, text and CPV codes. They are not advice on whether to bid.
- Reference
- 21933349-7465-49c1-a0c0-59f1caeb33ed
- Source
- Contracts Finder
- Stage
- contract · Contract
- Last verified
- Fri 3 Jul 2026, 01:03 BST
- Read at
- Sat 17 Oct 2026, 00:19 BST
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