Find a Tender · Historical
Supply and Installation of iBond 5000 Wedge Bonder System with Microscope and Bonding Accessories
Historical: no longer open for bids.
01/ The notice
Key facts
- Value
- Not statedValue not stated in source
- Deadline (UK time)
- No open deadlineA deadline does not apply to this historical notice.
- Published
- 14 Oct 2026
- Region
- Not stated
02/ The brief
What the notice says
Not fully read: this is the notice text; attached documents are not read.
Supply of an iBond 5000 manual ultrasonic wedge bonder for microelectronics and semiconductor packaging applications, including an Olympus stereo zoom microscope, deep-access wire and ribbon bonding clamp assemblies, heated workholder, ribbon spool holder, and related accessories. The contract also includes installation, commissioning, and operational training for users at NPL.
03/ Classification
CPV codes
Common Procurement Vocabulary codes, exactly as the notice lists them. No descriptions are added here.
- 42661100
04/ History
Releases of this notice
One release held, oldest first. Dates are UK time.
- 14 Oct 2026Notice
Notice published 14 October 2026.
Release 097209-2026
View this release on Find a Tender (opens in a new tab)
05/ Limits
What the source does not tell us
- The source does not state a usable value.
- Only one release is held, so there is no change history.
06/ Questions
About this notice
07/ Related
Where to go next
These links follow a fixed rule applied to this notice’s buyer, text and CPV codes. They are not advice on whether to bid.
- Reference
- ocds-h6vhtk-0787fc
- Source
- Find a Tender
- Stage
- award · Awarded
- Last verified
- Wed 14 Oct 2026, 23:16 BST
- Read at
- Sun 18 Oct 2026, 03:51 BST
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