Find a Tender · Forecast
Supply, Delivery and Installation Sinter Bonding Capability
Forecast: a planned procurement that is not yet at tender stage.
01/ The notice
Key facts
- Value
- Not statedValue not stated in source
- Deadline (UK time)
- No open deadlineA deadline does not apply to this forecast notice.
- Published
- 20 Oct 2025
- Region
- Not stated
02/ The brief
What the notice says
Not fully read: this is the notice text; attached documents are not read.
National Manufacturing Institute Scotland (NMIS) is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. A solution is required to form sintered bonds between: dies on substrates in multi-die packages with different component heights; substrates on heat sinks; clips, spacers and interconnection parts; double-sided cooling packages.
03/ Classification
CPV codes
Common Procurement Vocabulary codes, exactly as the notice lists them. No descriptions are added here.
- 38000000
04/ History
Releases of this notice
One release held, oldest first. Dates are UK time.
- 20 Oct 2025Planning notice
Planning notice published 20 October 2025.
Release 066666-2025
View this release on Find a Tender (opens in a new tab)
05/ Limits
What the source does not tell us
- The source does not state a usable value.
- Only one release is held, so there is no change history.
06/ Questions
About this notice
07/ Related
Where to go next
These links follow a fixed rule applied to this notice’s buyer, text and CPV codes. They are not advice on whether to bid.
- Reference
- ocds-h6vhtk-05cfa9
- Source
- Find a Tender
- Stage
- planning · Planning
- Last verified
- Sun 5 Apr 2026, 21:05 BST
- Read at
- Tue 20 Oct 2026, 20:35 BST
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