Lapping and Polishing Machine

Scope

The Compound Semiconductor Applications (CSA) Catapult is creating a modular, flexible, accelerated prototype package assembly and test facility for RF, Photonics, and Power compound semiconductor devices, modules, and systems. The facility enables research, proof of concept and provides the capability to demonstrate the feasibility and undertake small volume prototype builds as the system is not for mass production.

As a part of the package assembly research and development methodology, we require a lapping and polishing machine to handle a wide range of metals and ceramics (copper, aluminium, titanium, beryllium, molybdenum, alumina, zirconium oxide and fused silica, silicon carbide and silicon nitride) for packaging purposes. This equipment shall be capable of lapping and polishing a wide range of 3D printed metal and ceramics from 25 um up to 50 nm and also from 25 um down to 50 um. The Machine or combination of machines shall be capable of polishing 2D and 3D parts. The size of the parts to be processed ranges from 130 x 130 x130 to 250 x 250 x 250 mm and suppliers can submit separate quotes for various systems with different lapping plate dimension ranging from 15" to 28". Detail of a machine or combination of machines for polishing 3D surface i.e., non-flat surfaces and consumables is required as part of the tender. The system will be used mostly in the Packaging Team to support power electronics, RF and photonics packaging applications.

The manufacturer/authorised vendor shall install the system at the Innovation Centre, CSA Catapult, which will be equipped with access to all power and services for full installation and operation and be used to support contract research and development or commercial opportunities within the UK. The manufacturer/authorised vendor is also responsible for providing necessary training, warranty, and service/maintenance support.

System Outline

The system is expected to be robust to handle the material listed above with a means of extracting dust and waste fluid from the enclosed space. The speed of the machine required for the 2D parts polishing must be adjustable with automatic plate flatness control and composed of automatic slurry dispense. The machine should be fully programmable requiring little skill to operate. A system solution is required that is flexible and upgradable in the future. The system should also include user software, installation and training. The machine or combination of machines shall be able to achieve lapping and polishing to the required level. The machine shall be fully programmable with an enclosed workspace with adjustable pneumatic pressure on the part. The supplier shall provide detailed information on the processes involved and consumables required for the lapping and polishing process including ultrasonic cleaning. Also, a list of any metrology tools required for the processes is needed.