Laser Dicing and Drilling System

The Compound Semiconductor Applications (CSA) Catapult is creating a modular, flexible, accelerated prototype package assembly and test facility for RF, Photonics, and Power compound semiconductor devices, modules, and systems. The facility enables research, proof of concept and provides the capability to demonstrate the feasibility and undertake small volume prototype builds. The system is not for mass production and high edge quality is a target from dicing and drilling processes.

As a part of the package assembly research and development methodology, we require a laser dicing and drilling machine to handle A wide range of semiconductor (silicon, silicon carbide, silicon carbide, gallium arsenide, gallium nitride, alumina) and ceramic materials (such as alumina) for packaging purposes. This equipment shall be capable of dicing and drilling a wide range of semiconductors materials and ceramics with thicknesses in the range of 100 micrometres up to 1.5 mm (thicker ranges are preferable if applicable) and drilling holes as small as 20 micrometre in diameter (surface roughness should be less than 1 micron). High quality diced edges and drilled holes is required with a minimum laser taper angle of less than 8 degrees and preferably 90-degree cut. This system will be used mostly in the Packaging Team to support power electronics, RF and photonics packaging applications.

The machine shall be able to achieve full-cut dicing. It will be needed to integrate in the machine tape removal after dicing process completion. The machine shall have a visual monitoring system for inspection during dicing and drilling. The machine should handle wide ranges of material thickness 100 micron to 1.5 mm (preferably higher if applicable) and work with high drilling aspect ratios (material thickness /drill diameter) as high as 20:1 (preferably 50:1 if applicable) with high-quality edge finish and minimum taper angle (preferably 90-degree cut).

The system shall provide options for software development kits (SDK), for example compatible with LabVIEW, MATLAB and so forth. This should help in extending machine capabilities to include applications such as resistance laser trimming.

The system is expected to be composed of a Class 1 laser drilling and dicing chassis with an integrated air-cooling unit, including several options to handle diverse material types and thicknesses and a wide range of drilling aspect ratios using a laser source. The system shall include auxiliaries such as vision inspection, fume extractor systems, and a viewing window to be able to check when laser is on or off, during operation. The machine software should be user friendly and enable a wide range of users with different skill levels to utilize the machine. The machine should have a precise power meter to control the laser source power. Safety features such as a handheld barcode reader/scanner should be incorporated.

A system solution is required that is flexible and upgradable in the future.