Find a Tender · Live tender
COMPOUND SEMICONDUCTOR APPLICATIONS CATAPULT LIMITED
Metal 3D Printer
Live: the notice is at tender stage.
01/ The notice
Key facts
- Value
- Not statedValue not stated in source
- Deadline (UK time)
- No deadline statedThe source does not state a submission deadline.
- Published
- 25 May 2021
- Region
- Not stated
02/ The brief
What the notice says
Not fully read: this is the notice text; attached documents are not read.
Scope The Compound Semiconductor Applications (CSA) Catapult is looking to create a modular, flexible, accelerated prototype package assembly and test facility for RF, Photonics, and Power compound semiconductor devices, modules and systems. This would allow research, proof of concept and demonstrate its feasibility and small volume prototype build. As part of the electronics package assembly research and development methodology we require a machine that can produce customised prototype metal parts using additive manufacturing technology. This will allow the CSA Catapult to support the Driving the Electric Revolution - Industrialisation Centres (DERIC) programme that is currently active within the UK in developing novel technology for power electronic devices and other types of semiconductor devices. The intention is that the additive manufacturing of bespoke metal components will closely support the requirements of development programmes and further the development of electronic and semiconductor device packaging with novel solutions not currently possible using traditional manufacturing techniques. The equipment will also compliment the hybridisation programmes for packaging that are currently in progress at the CSA Catapult. The equipment shall be flexible and be able to process several metals compatible with the advanced packaging of electronic devices. These include copper, nickel alloys, and stainless steels. Other materials may be of interest as well due the nature of any developments. The manufacturer/authorised vendor shall install the system at CSA Catapults Innovation Centre, which will be equipped with access to all power and services for full installation and operation and be used to support contract research and development or commercial opportunities within the UK. The manufacturer/authorised vendor is also responsible for providing necessary training, warranty and service/maintenance support System Outline The system architecture is expected to be a standalone machine and is expected to have additional post processing equipment to support the component build. This will include equipment for cleaning, curing and sintering of the parts to produce this final component. It may also include equipment to handle, store and sort the raw material. The system should have capability to be used for both prototype device and low volume production quantities. The system shall be easy to configure and change for the user to allow different processes. A system solution is required that is flexible and upgradeable in the future. Additional module options can then be purchased based on changing industry trends or specific requirements from customers or partners for technology development. The system should also include user software, installation and training. The estimated value of the contract is £250,000 to £350,000 including all options and extensions. The system will be ordered in June and installed in September 2021.
03/ Classification
CPV codes
Common Procurement Vocabulary codes, exactly as the notice lists them. No descriptions are added here.
- 38000000
04/ History
Releases of this notice
2 releases held, oldest first. Dates are UK time.
- 30 Apr 2021Tender notice
Tender notice published 30 April 2021.
Deadline in this release: Thu 13 May 2021, 10:30 BST.
Release 009390-2021
View this release on Find a Tender (opens in a new tab) - 25 May 2021Tender notice update
Tender notice update published 25 May 2021. Stated change: Scope The Compound Semiconductor Applications (CSA) Catapult is looking to create a modular, flexible, accelerated prototype package assembly and test facility for RF, Photonics, and Power compound semiconductor devices, modules and systems. This would allow research, proof of concept and demonstrate its feasibility and small volume prototype build. As part of the electronics package assembly research and development methodology we require a machine that can produce customised prototype metal parts using additive manufacturing technology. This will allow the CSA Catapult to support the Driving the Electric Revolution - Industrialisation Centres (DERIC) programme that is currently active within the UK in developing novel technology for power electronic devices and other types of semiconductor devices. The intention is that the additive manufacturing of bespoke metal components will closely support the requirements of development programmes and further the development of electronic and semiconductor device packaging with novel solutions not currently possible using traditional manufacturing techniques. The equipment will also compliment the hybridisation programmes for packaging that are currently in progress at the CSA Catapult. The equipment shall be flexible and be able to process several metals compatible with the advanced packaging of electronic devices. These include copper, nickel alloys, and stainless steels. Other materials may be of interest as well due the nature of any developments. The manufacturer/authorised vendor shall install the system at CSA Catapults Innovation Centre, which will be equipped with access to all power and services for full installation and operation and be used to support contract research and development or commercial opportunities within the UK. The manufacturer/authorised vendor is also responsible for providing necessary training, warranty and service/maintenance support System Outline The system architecture is expected to be a
Release 011643-2021
View this release on Find a Tender (opens in a new tab)
05/ Limits
What the source does not tell us
- The source does not state a submission deadline.
- The source does not state a usable value.
06/ Questions
About this notice
08/ Related
Where to go next
These links follow a fixed rule applied to this notice’s buyer, text and CPV codes. They are not advice on whether to bid.
- Reference
- ocds-h6vhtk-02ac1f
- Source
- Find a Tender
- Stage
- tender · Open
- Last verified
- Sun 5 Apr 2026, 13:26 BST
- Read at
- Fri 23 Oct 2026, 05:29 BST
Contains public sector information licensed under the Open Government Licence v3.0. Source data © Crown copyright.
Built on published notices from Find a Tender and Contracts Finder.