Metrology Microscope

The Compound Semiconductor Applications Catapult is looking to create a modular, flexible, accelerated prototype package assembly and test facility for RF, Photonics, and Power compound semiconductor devices, modules and systems. This would allow experimentation, feasibility, proof of concept and small prototype volume build.

As part of the package assembly research and development methodology, we require a digital microscope to perform measurement and imaging of semiconductor-die, packages at various stages of assembly, modules and populated/unpopulated printed circuit boards (PCBs).

The measurement system shall allow the CSA Catapult to perform in-house 3D geometrical measurement throughout the packaging and electronics assembly process. The equipment is intended to facilitate first article inspection, provide a quantitative description of component and assembly geometry, providing analysis and validation steps. The system shall also be capable of creating exportable 3D surfaces from measured parts,rapid analysis, and measurement generation suited to evaluating whole assemblies quickly. Further typical measurements would include bonded die, die surfaces, positional information on placed and soldered components, wire bonds, both loop height and foot geometry. The system will be applied to all package and module architectures within the Photonics, Power Electronics and RF modules, and further to a range of custom small components.

The manufacturer/authorised vendor shall install the system at the Innovation Centre, CSA Catapult, by January 2021.